> Surface Mount PCB Assembly
Our Surface Mount Assembly capability is a key service offering and supports much of our manufacturing activity. Our in-house facilities permit the manufacture of both leaded and lead-free ( RoHS compliant ) product ( the former is still a significant requirement given the exclusion status of many of our customers ), and we have the ability to place all types of component package including BGA devices. Our processes are heavily automated and we have invested heavily in our manufacturing infrastructure.
Our highly skilled manufacturing engineering team are able to offer guidance and support to customers in respect of this activity whether it be relating to process optimisation or design guidance.
We are able to seamlessly transfer manufacturing between our own in-house facilities or our off-shore facilities depending on customer requirements, and the constraints of cost, quantity and lead-time.
- Leaded and lead-free ( RoHS compliant ) assembly process
- Capability to place all package types include BGA’s
- In-house and off-shore capability provides the best choice of service offering